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Showing 2 results for Silicon Nitride

Alaee M.s.,
Volume 3, Issue 1 (6-2006)
Abstract

plasma-sprayed silicon layers have been used to produce silicon nitride layers with fibrous microstructure which optimizes fracture toughness and strength. SEM examination of the specimens shows that the surface is covered by fine needles and whiskers of Si3N4.In order to study the oxygen contamination effect as well as other contaminants introduced during spraying and nitridation processes, surface sensitive analysis techniques like AES and XPS have been used to determine concentration of these contaminants.
E. Shahmohamadi, A. Mirhabibi, F. Golestanifard,
Volume 16, Issue 3 (9-2019)
Abstract

An accurate prediction of reaction kinetics of silicon nitridation is of great importance in designing procedure of material production and controlling of reaction. The main purpose of the present study is to investigate the effect of temperature on the kinetics of reaction bonded silicon nitride (RBSN) formation. To achieve this, nitrogen diffusion in the silicon nitride layer is considered as a reaction controlling factor and sharp interface method based on this theory is used to develop the analytical model. In the developed model, the variations in the size of silicon particles are calculated for the whole reaction. In the experimental phase, the extent of nitridation is measured for different reaction temperatures and 4 different reaction times and then, the occurrence of full nitridation is shown by EDS analysis. Furthermore, an analytical approach was established for describing the kinetics of compound formation and the performance of the developed model is evaluated through statistical analysis. There was good agreement between experimental data and predictions of the developed model which demonstrates the accuracy of considered presumptions and reaction mechanisms. An accurate prediction of reaction kinetics of silicon nitridation is of great importance in designing procedure of material production and controlling of reaction. The main purpose of the present study is to investigate the effect of temperature on the kinetics of reaction bonded silicon nitride (RBSN) formation. To achieve this, nitrogen diffusion in the silicon nitride layer is considered as a reaction controlling factor and sharp interface method based on this theory is used to develop the analytical model. In the developed model, the variations in the size of silicon particles are calculated for the whole reaction. In the experimental phase, the extent of nitridation is measured for different reaction temperatures and 4 different reaction times and then, the occurrence of full nitridation is shown by EDS analysis. Furthermore, an analytical approach was established for describing the kinetics of compound formation and the performance of the developed model is evaluated through statistical analysis. There was good agreement between experimental data and predictions of the developed model which demonstrates the accuracy of considered presumptions and reaction mechanisms.

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